Automatic 12 Chip Heads PCB Surface SMD Mounting Machine

Product Details:

Place of Origin:	China
Brand Name:	OEM
Certification:	CE , ISO

Payment & Shipping Terms:

Minimum Order Quantity:	1 unit
Price:	Negotiable
Packaging Details:	Standard Export Packing
Delivery Time:	15-20 days
Payment Terms:	L/C, T/T, Western Union, Paypal
Supply Ability:	100pcs per month

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Detailed Product Description

Application:	SMT PCB Assembly Production Line	Name:	Place Machine\LED Mounter\led Assembly Machine
Product Name:	Automatic SMD Capacitor Placement Machine	Usage:	SMD LED SMT
Applicable Components:	0201-120mm * 90mm, BGA, CSP,Connectors, Other Odd-shaped Components	Condition:	100% Original
Dimension:	L1,750 * D1,770 * H1,420mm	Weight:	1500KG
Transfer Height:	900 ± 20mm	Type:	Automatic
High Light:	1200KG SMD Mounting Machine , 12 Chip Heads SMD Assembly Machine , 1500KG SMD Mounting Machine

Automatic 12 Chip Heads PCB Surface SMD Mounting Machine

Product Description

ultra-flexible 12-chip head 3D MID three-dimensional placement machine is a product from the market for dispensing / spot solder paste / three-dimensional patch and comes with optical inspection to complete the assembly of the machine, from The smallest metric 0201 components to 120mm large components include dispensing/point solder paste/stereo mounting/pressing inserts/special inspection lenses, high precision and high speed assembly, and quick dispensing of the dispensing head. The patch head and the inspection head are switched, and the concave surface, the inclined surface, and the curved surface can be stereoscopically mounted, realizing high speed and ultra-wide use.

Main Feature:

1, to achieve 3D MID (MoldedInterconnect Device) process, the new frame and tilt structure can be three-dimensional assembly of concave and convex surface, inclined surface and curved surface, helping customers to achieve a leap from flat panel assembly to three-dimensional assembly, reducing assembly costs.

2, to achieve a combination of spot solder paste / point red glue / patch / plug-in function, and easy to switch, non-contact point plastic head can be spot solder paste on the cavity substrate to achieve stereoscopic three-dimensional assembly of uneven surface.

3, optical inspection of the spot solder paste and glue and the mounted components, the newly developed color mark point recognition camera can also perform stable optical inspection of the solder paste/glue shape and patch effect through the new illumination system (realizing AOI) +SPI function)

4, 2 types of head structure are available for selection, 6 patch head 6 rotation axis type and 12 patch head 2 rotation axis type.

5, large substrate assembly capability, the substrate can be up to 1825mmx 635mm (optional) without segmentation once board capacity 1240mm x 510mm

6, ultra-wide component range, from ultra-small 0201 (0.25x0.125mm) chip to 120mm large components can be processed, placement height of 35mm, easy to install ultra-high components.

7, super large feeding capacity, S20 8mm loading port reaches 4 * 45 = 180 types, S10 8mm loading port reaches 2 * 45 = 90 types, waffle plate loading 36 types and can achieve non-stop refueling.

8, motor gun and refueling car and achieve interchange with M10/M20.

Specifications

Model name		S10	S20
Board Size	With buffer unused	Min. L50 x W30mm to Max. L980 x W510mm	Min. L50 x W30mm to Max. L1,480 x W510mm
	With input or output buffers used	Min. L50 x W30mm to Max. L420 x W510mm	—
	With input and output buffers used	Min. L50 x W30mm to Max. L330 x W510mm	Min. L50 x W30mm to Max. L540 x W510mm
With input and output buffers used		0.4 - 5.0mm
Placement accuracy A (μ+3σ)		CHIP ± 0.040mm
Placement accuracy B (μ+3σ)		IC ± 0.025mm
Placement angle		± 180°
Component height (Board thickness + component height)		6-axis 6-theta head: Max. 35mm 12-axis 2-theta head: Max. 20mm
Applicable Components		0201-120mm x 90mm, BGA, CSP,Connectors, other odd-shaped components
Component package		8-56mm tape (F1/F2 Feeders), 8-88mm tape (F3 Electric Feeders), Stick, Tray
Component types (8mm tape conversion)		Max. 90 types (8mm tape), 45 lanes x 2	Max. 180 types (8mm tape), 45 lanes x 4
Transfer height		900 ± 20mm
Machine Dimensions		L1,250 x D1,770 x H1,420mm	L1,750 x D1,770 x H1,420mm
Weight		Approx. 1,200kg	Approx. 1,500kg